Integrated circuit apparatus
US10068856B2 · kind B2 · utility
0Cited by
3References
44Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2017 |
| Grant date | Sep 4, 2018 |
| Priority date | — |
| Expiry date | May 31, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit apparatus includes a substrate, an IC chip disposed above the substrate, and an electromagnetic shielding layer disposed on a surface of the substrate. The IC chip includes an electromagnetic coupling device. The electromagnetic shielding layer and the electromagnetic coupling device partially overlap in a vertical projection direction of the surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.