Patent · US Active

Making semiconductor devices with alignment bonding and substrate removal

US10068888B2 · kind B2 · utility

8Cited by

2References

16Claims

0Family size

Assignee

HONG KONG BEIDA JADE BIRD DISPLAY LIMITED · CN

Inventors

Lei Zhang · Shanghai, CN
Fang Ou · Monterey Park, US
Qiming Li · Beijing, CN

Key dates

Filing date	Sep 19, 2016
Grant date	Sep 4, 2018
Priority date	—
Expiry date	Oct 19, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/857
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments include a manufacturing method of making a semiconductor device via multiple stages of alignment bonding and substrate removal. One example is an integrated full-color LED display panel, in which multiple wafers with different arrays of LEDs are integrated onto a host wafer with driver circuitry. The driver circuitry typically is an array of pixel drivers that drive individual LEDs on the display panel.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.