Solid-state imaging device, manufacturing method thereof, and camera with arranged pixel combinations alternatively
US10068939B2 · kind B2 · utility
11Cited by
6References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2017 |
| Grant date | Sep 4, 2018 |
| Priority date | — |
| Expiry date | Feb 17, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N2209/045
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solid-state imaging device includes a semiconductor substrate; and a pixel unit having a plurality of pixels on the semiconductor substrate, wherein the pixel unit includes first pixel groups having two or more pixels and second pixel groups being different from the first pixel groups, wherein a portion of the pixels in the first pixel groups and a portion of the pixels in the second pixel groups share a floating diffusion element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.