Method of manufacturing light emitting device
US10069045B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2017 |
| Grant date | Sep 4, 2018 |
| Priority date | — |
| Expiry date | Apr 10, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8511
Abstract
A method of manufacturing a light emitting device including: forming a supporting body on a mounting surface of each of semiconductor light emitting elements; arranging the semiconductor light emitting elements to be spaced apart from each other by a predetermined distance; and forming a wavelength conversion layer to continuously cover an upper surface and side surfaces of at least one of the semiconductor light emitting elements. The forming the wavelength conversion layer includes spraying a slurry provided by mixing particles of a wavelength conversion member and a thermosetting resin in a solvent onto the upper surface and the side surfaces of the semiconductor light emitting element, so that a thickness of the wavelength conversion layer at a lower portion of the side surfaces of the supporting body is smaller than the thickness on the upper surface and the side surfaces of the semiconductor light emitting element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.