Electronic component and manufacturing method thereof
US10070530B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2017 |
| Grant date | Sep 4, 2018 |
| Priority date | — |
| Expiry date | Jul 10, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1316
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component includes a substrate including a first principal surface, a second principal surface positioned on a side opposite to the first principal surface, a first side surface that connects the first principal surface and the second principal surface and that extends along a first direction, a second side surface that connects the first principal surface and the second principal surface and that extends along a second direction intersecting the first direction, and a corner portion that connects the first side surface and the second side surface and that has a curved surface curved outwardly, and a chip arranged at the first principal surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.