Immersion cooled electronic assemblies
US10070558B2 · kind B2 · utility
19Cited by
12References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2016 |
| Grant date | Sep 4, 2018 |
| Priority date | — |
| Expiry date | Apr 7, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20936
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An immersion cooled electronics arrangement includes a sealed housing, a coolant contained within the sealed housing, and an electronic device disposed within the sealed housing. The sealed housing has a variable-volume alterable between at least a first volume and a second volume in response to changes in pressure within the sealed housing to reduce the rate of pressure change in the sealed housing over time from heating of the coolant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.