Method for manufacturing an electronic device
US10070569B2 · kind B2 · utility
0Cited by
16References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2016 |
| Grant date | Sep 4, 2018 |
| Priority date | — |
| Expiry date | Jul 8, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53187
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system for assembling electronic devices includes at least one coating element for applying a moisture-resistant coating to surfaces of a device under assembly, or an electronic device under assembly. As components and one or more moisture-resistant coatings are added to the electronic device under assembly to form a finished electronic device, at least one surface on which the coating resides and, thus, at least a portion of the coating itself, is located internally within the finished electronic device. Methods for assembling electronic devices that include internally confined moisture-resistant coatings are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.