Patent · US Active

Printhead assembly with fluid interconnect cover

US10071557B2 · kind B2 · utility

0Cited by

14References

20Claims

0Family size

Assignee

HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. · US

Inventors

Rhonda L. Wilson · Monmouth, US
Mark A. Devries · Corvallis, US

Key dates

Filing date	Sep 8, 2016
Grant date	Sep 11, 2018
Priority date	—
Expiry date	Sep 8, 2036

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB41J2002/17516
WIPO fieldTextile and paper machines
WIPO sectorMechanical engineering

Abstract

In one example implementation, a printhead assembly includes a fluid intake section, a fluid interconnect integrated with the fluid intake section to receive fluid from an ink supply assembly, and an air-permeable, fluid-resistant, fluid interconnect cover installed over the fluid interconnect.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.