Full graphics electronic in-mold label and applications thereof
US10071593B2 · kind B2 · utility
1Cited by
5References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 17, 2013 |
| Grant date | Sep 11, 2018 |
| Priority date | — |
| Expiry date | Dec 17, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24843
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electronic in-mold label includes a substrate having a first surface and a second surface. The substrate includes an electronics mounting area on the second surface and an electronic circuit positioned in the electronics mounting area. When the electronic in-mold label is molded on to, or into, a plastic product, the electronic circuit is molded into the plastic product and is operable to perform a function.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.