Patent · US Active

Pressure-sensitive adhesives for bonding flexible printing plates

US10072188B2 · kind B2 · utility

0Cited by

6References

10Claims

0Family size

Assignee

tesa SE · DE

Inventors

Kristin Kerber · Hamburg, DE
Kai Ellringmann · Hamburg, DE

Key dates

Filing date	Jul 12, 2017
Grant date	Sep 11, 2018
Priority date	—
Expiry date	Jul 12, 2037

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09J2433/00
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A pressure-sensitive adhesive comprising at least one adhesive component comprising at least one polymer component based on a monomer mixture comprising at least one of the following monomers:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.