Method and device for connecting and separating two elements, with connecting plates
US10072915B2 · kind B2 · utility
4Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2014 |
| Grant date | Sep 11, 2018 |
| Priority date | — |
| Expiry date | Nov 18, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB64G1/6455
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
A method and device enable the linear separation of two elements attached to each other, through two respective connecting surfaces of these two elements. A connecting layer is placed between both connecting parts. Thermite is used to melt this connecting layer. The thermite can be placed on the other side of the first connecting part towards the first element, a heat protecting plate completing this assembly. The thermite can also be placed in grooves provided on the connecting surface of the second connecting plate to be directly in contact with the connecting layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.