Device having element electrode connected to penetrating wire, and method for manufacturing the same
US10073064B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2015 |
| Grant date | Sep 11, 2018 |
| Priority date | — |
| Expiry date | Aug 17, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/101
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
According to a method for manufacturing a device in which an electrode of an element is electrically connected to a penetrating wire in a substrate, a structure is prepared in which the element is arranged on the first substrate having a through hole formed therein: and a second substrate is prepared which has an electroconductive seed layer formed thereon. Then, a wall part is formed on the first substrate; a seed layer is joined to a face on an element side of the structure through a bonding layer; the bonding layer is removed; and the seed layer is exposed in the inside of the opening. The inside of the wall part and the through hole is filled with a conductor, with the use of the seed layer through electrolytic plating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.