Embedding diamond and other ceramic media into metal substrates to form thermal interface materials
US10074589B2 · kind B2 · utility
0Cited by
3References
12Claims
0Family size
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Key dates
| Filing date | Apr 14, 2016 |
| Grant date | Sep 11, 2018 |
| Priority date | — |
| Expiry date | Apr 14, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/42
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-layer structure includes a substrate with a surface and with particles partially covering and partially embedded in the surface. The particles have high thermal conductivity and low electrical conductivity. A dielectric layer on the surface partially covers the partially embedded particles. A metal layer on the dielectric layer covering the partially covered particles forms a thermal interface material (TIM) for electronic packaging applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.