Semiconductor package with integrated output inductor using conductive clips
US10074620B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2016 |
| Grant date | Sep 11, 2018 |
| Priority date | — |
| Expiry date | Dec 12, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02M3/158
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a semiconductor die having a control transistor and a sync transistor, an integrated output inductor having a winding around a core, and coupled to the semiconductor die, where the winding includes a plurality of top conductive clips connected to a plurality of bottom conductive clips. The control transistor and the sync transistor are configured as a half-bridge. The integrated output inductor is coupled to a switched node of the half-bridge. At least one of the plurality of top conductive clips and the plurality of bottom conductive clips includes a partially etched portion and a non-etched portion. The semiconductor die is attached to the integrated output inductor by a die attach material. The semiconductor die and the integrated output inductor are encapsulated in a molding compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.