Systems, method and apparatus for curing conductive paste
US10074765B2 · kind B2 · utility
0Cited by
173References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2017 |
| Grant date | Sep 11, 2018 |
| Priority date | — |
| Expiry date | Jul 12, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
One embodiment can provide a system for curing conductive paste applied on photovoltaic structures. The system can include a wafer carrier for carrying a plurality of photovoltaic structures and a heater. The wafer carrier can include a surface element that is in direct contact with the photovoltaic structures and is substantially thermally insulating. The heater can be positioned above the wafer carrier. The heater can include a heated radiation surface that does not directly contact the photovoltaic structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.