LED module, method for manufacturing the same, and LED channel letter including the same
US10074779B2 · kind B2 · utility
0Cited by
1References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2014 |
| Grant date | Sep 11, 2018 |
| Priority date | — |
| Expiry date | Oct 1, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A light emitting diode (LED) module including: a circuit board; at least one LED disposed on the circuit board; a molding cover spaced apart from the LED by a predetermined gap and covering upper and lower surfaces of the circuit board at an edge of the circuit board; and a circuit part positioned at the edge of the circuit board and driving the LED. The LED is centrally disposed on an upper surface of the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.