Support for audio system and audio equipment comprising such a support
US10075780B2 · kind B2 · utility
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15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2014 |
| Grant date | Sep 11, 2018 |
| Priority date | — |
| Expiry date | Dec 23, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R9/022
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The invention relates to a support for an audio system, the audio system comprising a heat source, a discharge surface for the heat and means for conducting at least one portion of the heat produced by the heat source towards the discharge surface. The support further comprises a plate comprising at least one heat-conducting elastic member able to deform for fitting at least one portion of the discharge surface of the audio system, and a thermal dissipation radiator in thermal contact with the elastic member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.