Substrate for printed circuit board, printed circuit board, and method for producing printed circuit board
US10076028B2 · kind B2 · utility
1Cited by
15References
9Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jan 19, 2016 |
| Grant date | Sep 11, 2018 |
| Priority date | — |
| Expiry date | Jan 19, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1131
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties and a sintered layer formed of a plurality of metal particles, the sintered layer being stacked on at least one surface of the base film, in which a region of the sintered layer extending from an interface between the sintered layer and the base film to a position 500 nm or less from the interface has a porosity of 1% or more and 50% or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.