Devices and methods for bending or cutting implants
US10076376B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 2015 |
| Grant date | Sep 18, 2018 |
| Priority date | — |
| Expiry date | Oct 20, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB21D11/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Devices and methods for bending or cutting implants are disclosed herein. In some embodiments, an instrument can include a rotatable drive shaft that urges first and second portions of a modular bending or cutting template toward one another to bend or cut an implant disposed between the template portions. A linkage assembly can be included to provide a mechanical advantage in urging the template portions toward one another. In some embodiments, an instrument can include a rotatable drive shaft that, depending on direction of rotation, pushes or pulls a first modular template portion with respect to a second modular template portion to bend an implant disposed between the template portions in one direction or another direction. In some embodiments, an instrument can include a worm drive that rotates a cutting wheel with respect to a cutting plate to cut an implant inserted through openings formed in the cutting wheel and the cutting plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.