Molding system
US10076862B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2017 |
| Grant date | Sep 18, 2018 |
| Priority date | — |
| Expiry date | Nov 23, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2945/76939
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molding system includes a molding machine, a mold disposed on the molding machine and having a mold cavity to be filled with a molding resin from the molding machine, and a computing apparatus connected to the molding machine. The computing apparatus is configured to perform operations for setting the molding machine to prepare a molding product, wherein the operations comprise: generating a first and a second state waveforms using a setting packing pressure profile; obtaining an updated packing pressure profile based on the first and the second state waveforms; and setting the molding machine based on the updated packing pressure profile to perform an actual molding process to prepare the molding product. The first and the second state waveforms express a relationship between an in-mold pressure and an in-mold temperature at different sensing sites of the molding resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.