Footwear having molded portion(s)
US10076886B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 21, 2016 |
| Grant date | Sep 18, 2018 |
| Priority date | — |
| Expiry date | Dec 18, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29D35/126
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Methods of and molds for manufacturing footwear are disclosed. In one example, the method may include forming at least one molded portion adjacent to at least one non-molded portion such that part of the at least one molded portion overlaps and contacts the at least one non-molded portion, and forming the at least one molded portion to include end portions that are adjacent the part of the at least one molded portion and that extend away from the at least one non-molded portion such that the end portions do not contact the at least one non-molded portion; moving the end portions of the at least one molded portion toward the at least one non-molded portion such that the end portions contact the at least one non-molded portion; and securing the end portions of the at least one molded portion to the at least one non-molded portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.