Curable composition and process for the manufacture of an epoxy thermoset
US10077332B2 · kind B2 · utility
1Cited by
14References
9Claims
0Family size
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Key dates
| Filing date | Jul 3, 2014 |
| Grant date | Sep 18, 2018 |
| Priority date | — |
| Expiry date | May 15, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2463/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Curable composition comprising at least one epoxy resin and at least one curing agent selected from derivatives of 5-hydroxymethylfurfural. Curable dispersion, curable prepolymer composition and process for manufacturing it. Process for the manufacture of an epoxy thermoset, epoxy thermoset and method for adhering at least two substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.