Integrated lens-array-on-substrate for optical coupling system and fabrication method thereof
US10078184B2 · kind B2 · utility
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12Claims
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Key dates
| Filing date | Sep 22, 2016 |
| Grant date | Sep 18, 2018 |
| Priority date | — |
| Expiry date | Sep 22, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B27/1006
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An imprinting method for forming an integrated optical coupling device on wafer level may include: providing a substrate, with a reflection coating disposed thereon; providing an imprinting mold, with void regions shaped according to a designed lens profile; forming a molding material on the substrate; pressing the imprinting mold on the molding material on the substrate; curing the molding material into a cured molding material; removing the imprinting mold; depositing an anti-reflection film on the cured molding material; and dicing to form an integrated optical coupling device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.