Surface mount package for semiconductor devices with embedded heat spreaders
US10079160B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 23, 2014 |
| Grant date | Sep 18, 2018 |
| Priority date | — |
| Expiry date | Sep 27, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/8503
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of mounting one or more semiconductor or microelectronic chips, which includes providing a carrier; temporarily adhering the one or more semiconductor or microelectronic chips to the carrier with active faces of the one or more chips facing towards the carrier; providing a package body with at least one chip-receiving opening therein and with at least one contact opening therein; temporarily adhering the package body to the carrier with the at least one opening in the package body accommodating at least a portion of the one or more chips; covering backsides of the one or more chips and filling empty spaces between the one or more chips and walls of the at least one opening in the package body with a metallic material; filling the at least one contact opening with the aforementioned metallic material; wirebonding contacts on the active faces of the one or more chips with contact surfaces in electrical communication with the metallic material in the at least one contact opening; and releasing package body with the one or more chips embedded in the metallic material from the carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.