Substrate assembly and manufacturing method thereof and display device
US10079272B2 · kind B2 · utility
3Cited by
1References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2016 |
| Grant date | Sep 18, 2018 |
| Priority date | — |
| Expiry date | Jan 13, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/1201
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a substrate assembly comprising: a substrate; electrodes, metal wirings and TFTs formed on the substrate; and banks formed over the substrate, the banks enclosing pixel areas and exposing the electrodes; wherein a surface of the bank away from the substrate comprises one or more grooves, the grooves being adapted for collecting ink droplets remaining on the bank during subsequent inkjet printing process. The present invention further relates to a method for manufacturing a substrate assembly and a display device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.