Polymeric electromagnetic shield for electronic components
US10080317B2 · kind B2 · utility
1Cited by
7References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2016 |
| Grant date | Sep 18, 2018 |
| Priority date | — |
| Expiry date | Jun 29, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0715
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device can include a circuit board, an electronic component mounted on the circuit board, a conductive contact disposed (e.g., deposited) on the circuit board, and a shielding polymer layer deposited over the electronic component. The shielding polymer layer includes a network of conductive pathways formed from sintered particles. The network of conductive pathways is electrically coupled to the conductive contact, which can be configured for connection to a power source ground. As such, the network of conductive pathways enables electromagnetic shielding of the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.