Die mounted contact applicator
US10081022B2 · kind B2 · utility
0Cited by
2References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 14, 2016 |
| Grant date | Sep 25, 2018 |
| Priority date | — |
| Expiry date | Sep 14, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C65/4815
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A slot die assembly for applying at least one material onto a substrate includes an adapter having a passive heat transfer device, a shim package fluidically connected to the adapter, the shim package having a first material discharge slot and a second material discharge slot, and a die plate having a one or more fluid channels fluidically connected to the shim package. The assembly also includes one or more mounting studs extending from the adapter, the mounting studs configured to engage a parent machine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.