Patent · US Active

Flatness measuring and measuring of residual stresses for a metallic flat product

US10081041B2 · kind B2 · utility

1Cited by
6References
20Claims
0Family size

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Key dates

Filing dateNov 25, 2013
Grant dateSep 25, 2018
Priority date
Expiry dateNov 25, 2033

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB21B2261/06
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A method and apparatus for flatness measuring and measuring of residual stresses in a metallic flat product (1): The method includes bending the flat product (1) in a bending device (3) such that a planar flat product (1) forms an arc (5) with a target bending radius r0 after bending; measuring the contour and the actual bending radii r(y), in the region of the arc (5) of the bent flat product (1) at a plurality of positions along the width direction of the flat product (1); and determining the flatness of the flat product (1) taking into account the measured contour of the bent flat product (1).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.