Flatness measuring and measuring of residual stresses for a metallic flat product
US10081041B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2013 |
| Grant date | Sep 25, 2018 |
| Priority date | — |
| Expiry date | Nov 25, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB21B2261/06
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus for flatness measuring and measuring of residual stresses in a metallic flat product (1): The method includes bending the flat product (1) in a bending device (3) such that a planar flat product (1) forms an arc (5) with a target bending radius r0 after bending; measuring the contour and the actual bending radii r(y), in the region of the arc (5) of the bent flat product (1) at a plurality of positions along the width direction of the flat product (1); and determining the flatness of the flat product (1) taking into account the measured contour of the bent flat product (1).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.