Adhesive bonding process
US10081162B2 · kind B2 · utility
0Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2016 |
| Grant date | Sep 25, 2018 |
| Priority date | — |
| Expiry date | Nov 10, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2475/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An assemblage including a silicone part; and a double-sided adhesive tape including a support tape, a first layer of a pressure-sensitive adhesive (PSA) on a first face of the support tape, a second layer of a PSA on a second face of the support tape, and where the silicone part and the double-sided adhesive tape are adhesively bonded to one another using a non-silicone-based structural adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.