Process of forming transparent conductive coatings with sintering additives
US10081733B2 · kind B2 · utility
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5References
19Claims
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Assignee
Inventors
Key dates
| Filing date | Dec 30, 2015 |
| Grant date | Sep 25, 2018 |
| Priority date | — |
| Expiry date | Jan 25, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B1/22
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process is disclosed for the delayed sintering of metal nanoparticles in a self-assembled transparent conductive coating by incorporating a sintering additive into the water phase of the emulsion used to form the coating. The sintering additive reduces the standard reduction potential of the metal ion of the metal forming the nanoparticles by an amount greater than 0.1V but less than the full reduction potential of the metal ion. Emulsion compositions used in the process are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.