Gas supply nozzle, substrate processing apparatus, and non-transitory computer-readable recording medium
US10081868B2 · kind B2 · utility
5Cited by
0References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2016 |
| Grant date | Sep 25, 2018 |
| Priority date | — |
| Expiry date | Jul 15, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0228
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a technology including a nozzle base end portion which is provided in a processing chamber processing a substrate to extend in a vertical direction and into which a processing gas processing the substrate is introduced, a nozzle distal end portion which is configured in a U shape and in which a gas supply hole supplying the processing gas is provided to a side surface of the substrate, and a gas residence suppressing hole which is provided in a downstream end of the nozzle distal end portion and has a diameter larger than that of the gas supply hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.