Electronic device case and surface treatment method thereof
US10082732B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 2014 |
| Grant date | Sep 25, 2018 |
| Priority date | — |
| Expiry date | Oct 3, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1352
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A surface treatment method of an electronic device is provided. The surface treatment method includes processing a first pattern on a surface of a top mold and a second pattern on a surface of a bottom mold, coating a Ultra-Violet (UV) molding liquid on each of a front surface of a raw sheet material and the bottom mold facing a rear surface of the raw sheet material raw, positioning the raw sheet material between the top mold and the bottom mold, pressing the top mold and the bottom mold to each other, curing the UV molding liquid, and separating the raw sheet material from the top mold and the bottom mold and forming a print layer on the front surface and the rear surface of the raw sheet material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.