Apparatuses, methods, and systems for package on package memory refresh and self-refresh rate management
US10083735B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 25, 2017 |
| Grant date | Sep 25, 2018 |
| Priority date | — |
| Expiry date | Apr 25, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C11/40615
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Methods, systems, and apparatuses relating to package on package memory refresh and self-refresh rate management are described. In one embodiment, an apparatus includes a processor die, a dynamic memory die mounted to and overlapping the processor die, a first thermal sensor of the processor die disposed adjacent to a first hot spot from a first type of workload and a second thermal sensor of the processor die disposed adjacent to a second hot spot from a second type of workload, and a hardware control circuit of the processor die to cause a refresh of a capacitor of the dynamic memory die when either of an output of the first thermal sensor exceeds a first threshold value and an output of the second thermal sensor exceeds a second threshold value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.