Chip component-embedded resin multilayer substrate and manufacturing method thereof
US10083887B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2013 |
| Grant date | Sep 25, 2018 |
| Priority date | — |
| Expiry date | Oct 2, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a chip component-embedded resin multilayer substrate including a laminating body obtained by laminating a plurality of resin layers, a predetermined wiring conductor disposed in the laminating body, and a chip component embedded in the laminating body and having a side terminal electrode. A guarding member electrically isolated from the wiring conductor is provided to cover at least a part of a boundary between the side terminal electrode and the resin layers when viewed from a lamination direction of the laminating body, and the guarding member is formed from a material having a melting point higher than a temperature at which the resin layer begins to flow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.