Electronic component
US10084125B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2013 |
| Grant date | Sep 25, 2018 |
| Priority date | — |
| Expiry date | Dec 24, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/87
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An electronic component includes a substrate a functional section provided on the substrate, and a sealing body which is provided on the substrate and seals the functional section. In a temperature region having a lowest temperature that is at least as high as the glass transition temperature of the sealing body, the coefficient of linear expansion of the sealing body is greater than the coefficient of linear expansion of the substrate. In a temperature region having a highest temperature that is lower than the glass transition temperature of the sealing body, the coefficient of linear expansion of the sealing body is less than the coefficient of linear expansion of the substrate. The electronic component exhibits superior reliability even upon prolonged use.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.