Earphone assemblies with multiple subassembly housings
US10085080B2 · kind B2 · utility
2Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2017 |
| Grant date | Sep 25, 2018 |
| Priority date | — |
| Expiry date | Sep 6, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2460/07
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Earphone assemblies with multiple subassembly housings are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.