Electronic module
US10085345B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2014 |
| Grant date | Sep 25, 2018 |
| Priority date | — |
| Expiry date | Mar 12, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49169
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.