Glass enclosures for electronic devices
US10085357B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2016 |
| Grant date | Sep 25, 2018 |
| Priority date | — |
| Expiry date | Nov 30, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/42
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The disclosed embodiments include enclosures for electronic devices formed from RF-transparent, toughened glass materials, such as chemically hardened alkali-aluminosilicate glass. For example, according to the disclosed embodiments, an enclosure for an electronic device may be formed from a plurality of enclosure components joined together along corresponding interfaces to establish an enclosure structure, or alternatively, may be formed from a single enclosure component. In some aspects, the enclosure structure may have corresponding first and second ends, the enclosure structure may have corresponding first and second surfaces, and the second surface may be exposed to an environment. The enclosure may also include first and second cap components disposed at corresponding ones of the first and second ends.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.