Thermal conducting structure applied to network control automation system
US10085365B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 24, 2017 |
| Grant date | Sep 25, 2018 |
| Priority date | — |
| Expiry date | May 24, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermal conducting structure applied to a network control automation system includes a circuit module and a heat dissipation structure. Copper foil layers are horizontally disposed on bare copper regions disposed at top and bottom sides of circuit board. An outer shell member includes side panels disposed at top and bottom sides, and each side panel defines a track member comprising a sliding edge. The copper foil layers can be slidably mounted along sliding edges, and outer shell member is pushed to inwardly move relative to circuit board, then circuit board is positioned in accommodation open chamber formed between outer shell member and two side panels. While assembling, copper foil layers are abutted and mounted with sliding slots, forming thermal conducting path. Heat generated by heat source can be conducted to heat dissipation structure through two copper foil layers, to increase heat dissipation area and improve heat dissipation efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.