Laser processing machine
US10086475B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2018 |
| Grant date | Oct 2, 2018 |
| Priority date | — |
| Expiry date | Feb 8, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49778
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Laser processing machines, such as laser cutting machine, including a work table receiving workpiece, and work arm with a laser cutting head. Laser cutting head includes nozzle receiving device and nozzle. Via nozzle laser beam may be directed onto work piece. Machine includes main drives moving work arm and/or the laser cutting head on X-Y-Z axes to process work piece, as well as an alignment unit to adjust laser beam. An adjusting station includes receiving unit fixing nozzle and/or the nozzle receiving device during centering of nozzle. The alignment unit has head element in laser cutting head. Head element receives nozzle and/or the nozzle receiving device and is slidable in X-Y directions, via the main drives. Head element may be fixed in a selected position, within the laser cutting head, via clamping device releasable during nozzle centering at adjusting station.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.