Formation of voids within components formed from porous substrates
US10087110B2 · kind B2 · utility
1Cited by
6References
19Claims
0Family size
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Key dates
| Filing date | Apr 18, 2017 |
| Grant date | Oct 2, 2018 |
| Priority date | — |
| Expiry date | Apr 18, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T50/60
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of creating a component comprises forming a substrate and depositing a template material within the substrate, such that there are a plurality of template member. The component is heated to a temperature above a melting point of the template material, such that the template material wicks into a porosity of the substrate and forms a component with voids. An average hydraulic diameter of the voids is less than 1 millimeter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.