Substrate for epitaxial growth, manufacturing method therefor, and substrate for superconducting wire
US10087552B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 23, 2013 |
| Grant date | Oct 2, 2018 |
| Priority date | — |
| Expiry date | Sep 18, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N60/85
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An objective of the present invention is to provide a copper substrate for epitaxial growth, which has higher biaxial crystal orientation, and a method for manufacturing the same. The substrate for epitaxial growth of the present invention contains a biaxially crystal-oriented copper layer, wherein the full width at half maximum Δϕ of a peak based on the pole figure of the copper layer is within 5° and the tail width Δβ of the peak based on the pole figure is within 15° Such a substrate for epitaxial growth is manufactured by a 1st step of performing heat treatment of a copper layer so that Δϕ is within 6° and the tail width Δβ is within 25°, and after the 1st step, a 2nd step of performing heat treatment of the copper layer at a temperature higher than the temperature for heat treatment in the 1st step, so that Δϕ is within 5° and the tail width Δβ is within 15°.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.