Damping adhesive
US10088011B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2017 |
| Grant date | Oct 2, 2018 |
| Priority date | — |
| Expiry date | Aug 16, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2852
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Adhesive damping systems are described. A damping system for reducing the effects on a substrate caused by a disruption in the substrate environment includes an adhesive having a plurality of three-dimensional particles dispersed therein. The particles are configured to provide a controlled response to an applied force field. The system further includes a sensor which measures an amplitude and frequency spectrum of the disruption. In a use configuration, the sensor determines the amplitude and frequency spectrum of the disruption received by the substrate; and the applied force field is dependent on the amplitude and frequency spectrum of the disruption.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.