Variable thickness heat pipe
US10088242B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2015 |
| Grant date | Oct 2, 2018 |
| Priority date | — |
| Expiry date | Apr 19, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
In one aspect, a cooling system is provided for use in computing devices, such as laptops, cell phones, and tablet computers. The cooling system includes a heat spreader coupled to a radiator via a heat pipe having a midline. The heat pipe includes a first end portion longitudinally extending along the midline, a second end portion longitudinally extending along the midline, and a mid-portion longitudinally extending along the midline. The mid-portion is located between the first end portion and the second end portion and it has a thickness that is greater than the thicknesses of both the first portion and the second portion thereby reducing the overall thermal resistance of the heat pipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.