Heat exchange device
US10088249B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2016 |
| Grant date | Oct 2, 2018 |
| Priority date | — |
| Expiry date | May 31, 2036 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2250/08
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat exchange device includes a housing, a heat exchange module, and a piezoelectric module. Isolated inner and outer circulation chambers are formed in the housing. The heat exchange module in the housing includes a stack of separated plates parallel to each other. An inner channel communicated with the inner circulation chamber and an outer channel communicated with the outer circulation chamber are defined respectively by both sides of one of the plates and the other adjacent plates. The piezoelectric module in the housing includes a piezoelectric chip, and first and second heat exchange sides thermally coupled to the piezoelectric chip. The first heat exchange side is located in the inner circulation chamber and the second heat exchange side is located in the outer circulation chamber, so that heat can be transferred between the inner and outer circulation chambers via the piezoelectric chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.