Heat flow sensor
US10088373B2 · kind B2 · utility
4Cited by
7References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2013 |
| Grant date | Oct 2, 2018 |
| Priority date | — |
| Expiry date | Aug 22, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K17/20
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A heat flow sensor (HFS) and use thereof, which heat flow sensor should have the lowest possible invasiveness and nevertheless is robust enough to satisfy the requirements of individual applications. For this purpose, the heat flow sensor includes an active sensor element, which is provided with a highly thermally conductive heat-conducting element (8, 9) on the cold side and on the hot side, wherein the sensor element is covered or encased by an extremely thin, electrically strongly insulating, chemically inert, and strongly adhering protective layer (6).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.