Heat dissipating structures and mobility apparatus for electronic headset frames
US10088867B2 · kind B2 · utility
0Cited by
7References
10Claims
0Family size
Inventors
Key dates
| Filing date | Sep 14, 2017 |
| Grant date | Oct 2, 2018 |
| Priority date | — |
| Expiry date | Sep 14, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/203
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat sink for electronic devices, such as wearable displays, dissipates heat away from and electrical component, such as a microprocessor. An adjustable support assembly permits adjustment of a visual display relative to a user's field of view.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.