IC chip card with integrated biometric sensor pads
US10089568B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 31, 2017 |
| Grant date | Oct 2, 2018 |
| Priority date | — |
| Expiry date | May 31, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/6677
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An integrated circuit (IC) chip card includes a card body and an integrated IC chip module located in a recess provided by the card body on one side thereof. The IC chip module includes a substrate having outward-facing and inward-facing surfaces, and a first plurality of contact pads supportably interconnected to the outward-facing surface of the substrate for contact engagement with at least one appendage of a user. The IC chip module further includes a first IC chip supportably interconnected to the inward-facing surface of the substrate and electrically interconnected to the first plurality of contact pads for processing a biometric signal received therefrom. The IC chip module may also include a second plurality of contact pads supportably interconnected to the outward-facing surface of the substrate for engaging a contact card reader for contact communication signal transmissions and/or a first antenna supportably interconnected to the inward-facing surface of the substrate for contactless communication signal transmissions with a contactless card reader. Communication signal processing may be completed by the first IC chip and/or a second IC chip supportably interconnected t…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.