Evaporation method including stretching a flexible substrate
US10090212B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | May 5, 2016 |
| Grant date | Oct 2, 2018 |
| Priority date | — |
| Expiry date | Jul 29, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An embodiment of the present disclosure discloses an evaporation method, including: providing a flexible substrate having an original size; stretching the flexible substrate to have an evaporation size, wherein, the evaporation size is greater than the original size; arranging a mask on a side of the flexible substrate having the evaporation size; evaporating a material onto the flexible substrate having the evaporation size by using the mask, to form a patterned film layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.