Patent · US Active

System and method for dual-region singulation

US10090215B2 · kind B2 · utility

0Cited by

1References

19Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Andrew Christopher Graeme Wood · St. Jakob im Rosental, AT
Gernot Fasching · Premstätten, AT
Marius Aurel Bodea · Villach, AT
Thomas Ostermann · Velden am Wörther See, AT
Erwin Bacher · Villach, AT

Key dates

Filing date	Jan 11, 2017
Grant date	Oct 2, 2018
Priority date	—
Expiry date	Jan 11, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/146
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor die includes a semiconductor circuit disposed within or over a substrate. A conductive contact pad is disposed over the substrate outside the semiconductor circuit. A floating electrical path ends at a singulated edge of the die. The electrical path is electrically coupled to the conductive contact pad.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.